Tokyo SeimitsuTOKYO SEIMITSU CO., LTD.7729東証プライム精密機器FY ending Mar 2026, consolidated, J-GAAP
Revenue by business segment, and the profit each one keeps.
Geographic revenue reported in annual filings
No geographic revenue breakdown was disclosed.
※ Segment figures include inter-segment sales and do not sum to the company total
X-axis: segment revenue CAGR. Y-axis: latest operating margin. Bubble size: revenue.
Bubble size represents latest revenue. Segments without a CAGR are placed at the left edge; their horizontal position is not a growth value. Color indicates positive or negative margin.
| Segment | Revenue CAGR | FY ending Mar 2022 | FY ending Mar 2023 | FY ending Mar 2024 | FY ending Mar 2025 | FY ending Mar 2026 |
|---|---|---|---|---|---|---|
| Semiconductor manufacturing device | +12.3%5y | 101,14524.4% | 112,36526.6% | 100,05519.9% | 113,48121.4% | 127,87822.2% |
| Measurement equipment | +9.0%5y | 29,55612.3% | 34,43613.4% | 34,62415.6% | 37,05314.6% | 38,96013.7% |
Top: revenue. Bottom: operating margin.
EDINET (FSA Japan)
有価証券報告書－第103期(2025/04/01－2026/03/31)
EDINET (FSA Japan)
有価証券報告書－第102期(2024/04/01－2025/03/31)
EDINET (FSA Japan)
有価証券報告書－第101期(2023/04/01－2024/03/31)
EDINET (FSA Japan)
有価証券報告書－第100期(2022/04/01－2023/03/31)
EDINET (FSA Japan)
有価証券報告書－第99期(令和3年4月1日－令和4年3月31日)
EDINET (FSA Japan)
有価証券報告書－第98期(令和2年4月1日－令和3年3月31日)
Extracted from XBRL: 55 / Derived from other figures: 1
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